1. 2. 3. material content data sheet sales product name bsc750n10nd g issued 29. august 2013 ma# MA000866714 package pg-tdson-8-4 weight* 97.29 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.354 2.42 2.42 24190 24190 leadframe non noble metal iron 7439-89-6 0.045 0.05 460 inorganic material phosphorus 7723-14-0 0.013 0.01 138 non noble metal copper 7440-50-8 44.654 45.91 45.97 458973 459571 wire non noble metal aluminium 7429-90-5 0.264 0.27 0.27 2716 2716 encapsulation organic material carbon black 1333-86-4 0.090 0.09 926 plastics epoxy resin - 6.396 6.57 65735 inorganic material silicondioxide 60676-86-0 38.553 39.63 46.29 396265 462926 leadfinish non noble metal tin 7440-31-5 1.308 1.34 1.34 13440 13440 plating non noble metal nickel 7440-02-0 0.048 0.05 493 inorganic material phosphorus 7723-14-0 0.000 0.00 0.05 1 494 solder noble metal silver 7440-22-4 0.089 0.09 917 non noble metal tin 7440-31-5 0.071 0.07 733 non noble metal lead 7439-92-1 3.406 3.50 3.66 35013 36663 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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